PRODUCTS
E-TEST JIG
It is possible to manufacture a 2W&4W Fixture JIG using 20μm Wire Probe / 25μm Wire Probe / 30μm Wire Probe, and we recommend the optimal PASS range depending on PCB BUMP Pitch and Size.
When requesting a JIG for Bumped Die Stack Leakage Test / EBD(Embedded) PCB inspection, it is necessary to consult with the customer regarding the characteristics.
- What is Bumped Die Stack Leakage Test JIG?
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A JIG that performs an electrical leakage test of a die mounted on a PCB surface.
The die is attached to the top side of the PCB where the bump process was performed, and the electrical characteristics are checked by contacting the JIG wire probe to the soldering location.
( ex. IC Substrate for 2.5D/3D Package)
- What is JIG for Embedded Test?
- It is a JIG that inspects the characteristics of various devices such as capacitors, passive devices, and active devices mounted between layers inside the PCB.
High specification electrical characteristics inspection E-TEST JIG manufactured product
